What is TFAWS?
The Thermal and Fluids Analysis Workshop (TFAWS) is an annual training and professional development workshop that is designed to encourage knowledge sharing, professional development, and networking throughout the thermal and fluids engineering community within NASA and the aerospace community at large. The vision of TFAWS is to maintain continuity over time and between disciplines throughout the thermal and fluids engineering community.
For more information, see the TFAWS 2016 Program.
- Hosted by: NASA Ames Research Center (ARC)
- Sponsored by: NASA Engineering and Safety Center (NESC)
- NESC Sponsoring Technical Discipline Teams (TDTs):
- Passive Thermal
- Life Support/Active Thermal
- Conference Dates: August 1 – August 4, 2016
- Conference Location: Moffet Field, CA
- Keynote Speaker: TBA
- Registration Cost: FREE!
- NCTS Number (for Civil Servants): 24450-16
- Paper Sessions
- Software and Hardware Demonstrations
- Hands-on Software Training
- Technical Short Courses
- Guest Speakers
- Tours of Ames Research Center
Registration is FREE for all attendees!
Who Should Attend?
- International Guests and Partners
- Thermal and Fluids Analysis Tool Users
- Anyone interested in thermal and fluids analysis
All levels of experience are welcome!!
- Participants have the opportunity to share their work on the latest application of new and established methods to aerospace missions, impart engineering lessons learned, and compare/contrast engineering practices.
- Annual sharing of knowledge, hands-on instruction in relevant state-of-the-art engineering analysis tools, and seminars/short courses taught by the veterans in the thermal and fluids engineering community helps to ensure that the expertise of the community is maintained.
- Networking at TFAWS gives each engineer an extensive network of contacts which serves as an excellent source of advice and technical knowledge.
- TFAWS provides tremendous opportunities for enhancing collaboration between NASA centers, other government agencies, industry, academia, and the international thermal and fluids engineering community.
- Abstract Deadline: May 20, 2016
- Final Manuscript Deadline: July 27, 2016
- Registration Period: Online registration is closed. Attendees may register at the event registration desk.