Vendor Info

2003 Featured Vendors

Amtec Engineering, Inc.: Tecplot
Blue Ridge Numerics: CFDesign
CD adapco Group: STAR-CD
C&R Technologies: Thermal Desktop & RADCAD
Fluent, Inc.: Fluent and GAMBIT
Harvard Thermal: TAS PCB
Maya: TMG and ESC
MSC Software: Patran Thermal
NASA Langley: MINIVER and VULCAN
Network Analysis, Inc.: Thermica and FEMAP
PTC: Pro/Mechanica Thermal
Spacedesign: TSS and FEM
US Air Force: S/HABP
Wolfram Research, Inc.: Mathematica
Zona Tech, Inc.: ZONAIR

Software Courses Advertisements (Zipped PDF ~ 2.8 MB)
Software Demos Advertisements (Zipped PDF ~ 5 MB)


2002 Vendor Interest Survey

A vendor interest survey was sent out to the thermal and fluids analysis community in December 2002. The survey was used to help select which vendors should be invited to TFAWS 2003.

2002 vendor survey results



Computer Resources

CPU: Intel PIII - Rooms 1111, 1113, 1116 / Intel P4 - Room 1115
OS: Windows 2000 SP2\3
Clock Speed: 1 GHz - Rooms 1111, 1113, 1116 / 2.4 GHz - Room 1115
RAM: 128 MB - Rooms 1113, 1116 / 256 MB - Room 1115 / 512 MB - Room 1111
Disk Space: 10 GB on all drives
Graphics: ATI RAGE 128 Pro 16-32 MB - Rooms 1111, 1113, 1116/ NVIDIA 4 128 MB - Rm 1115
# of machines: 24 each in Rooms 1111, 1113 / 28 - Room 1115 / 16 - Room 1116
Mouse: all are 3-button


Vendor Booth Space

Booths are available for vendors. Booth sizes are 8 ft x 3 ft deep. Pipes and drapes will demarcate spaces. A 6 ft x 1.5 ft table, two chairs, 2 power outlets, and a trash can will be provided at minimum. 10 ft booths may be accommodated on a case by case basis.

Vendor Booth Layout