National Aeronautics and Space Administration

Glenn Research Center

Vendor Participation

TFAWS 2020 Vendors

Aerothreads
Ansys
CRTech
Gamma Technologies
Generalized Fluid System Simulation Program (GFSSP)
Harley Thermal LLC
Maya
Siemens
TERMA B.V.
Veritrek

Aerothreads

How to Fit Check and Install MLI in Quarantine

Multi-layer insulation (MLI) can be a critical part of your spacecraft thermal design. To ensure the best performance on orbit, fit and function are paramount. MLI fit check and installation can be a challenge when hardware access is limited and travel is restricted to prioritize health and safety. In this demo, Aerothreads will take you through our newly defined procedure for remote MLI template fit check and MLI installation.

Registration for this session includes a limited number of demo kits that will be mailed to you so you can try your hand at MLI fit check and installation. The kit includes a partially fabricated MLI, edge tape, a template, a 3D printed form, and brochures. Kits are limited and available to those registered by 8/9/2020. Please register here: https://calendly.com/ckelby-aerothreads/tfaws-mli-in-quarantine

**Inclusion of this link is to allow distribution of sample materials prior to the presentation. No official NASA endorsement of any organization or products is intended or implied. Note for Federal Employees: You may accept informational materials (documents, recordings, samples) that are for the purpose of the presentation and not primarily for personal use, of a value of less than $100. 5 CFR 2635.204.

Ansys

Ansys Thermal-Fluids Solutions
Presented By David Pons

Overview of Ansys solutions for thermal and Fluids applications. Including live demonstration.

CRTech

Co-solving 3D Fluid Flow and Heat Transfer with CRTech Thermal Desktop and ANSYS Fluent
Presented By Tim Pancazak

An introduction to co-solving conjugate heat transfer problems using CRTech Thermal Desktop and ANSYS Fluent presented with examples.

What’s Ahead in the CRTech Suite and Feature Demonstration
Presented By Douglas Bell

In this session we will provide a brief overview of the CRTech application suite; an overview of upcoming features in Thermal Desktop, FloCAD, TD Direct and OpenTD; and demonstrations of some underused features.

Gamma Technologies

GT-SUITE Multi-physics Simulation Software- Space Systems Demo
Presented By Jon Zenker

Do you simulate complex systems including multiple physical domains: fluids, thermal, electrical, battery, mechanics and controls? Are you looking for a simulation tool that runs faster than 3D CFD, but powerful enough to provide predictive answers to highly transient problems? Would you like an easy-to-use tool with both a 2D sketchpad and 3D building options? If so, we welcome you to learn about how GT-SUITE can be used for solving multi-physics related problems of complex systems including cryogenic propulsion, two-phase flow systems, and Li-ion battery thermal in this 1-hour software demonstration.

About Gamma Technologies: GT-SUITE simulation software is a unique transformational all-in-one CAE tool used at NASA and over 700 aerospace and automotive organizations. On one level, it is recognized to be a worldwide leader in high-level system modeling (1D). However, GT-SUITE is also a detailed 3D modeling tool, with built-in structural and thermal 3D FEA, 3-D multi-body dynamics with flexible bodies and 3D CFD. These are complemented by CAD modeling and automatic model generation from CAD.

Generalized Fluid System Simulation Program (GFSSP)

Presented By André LeClair

GFSSP is a general-purpose computer program for analyzing steady-state and time-dependent flow rate, pressure, temperature, and concentrations in a flow network. The program can model phase change, subsonic compressibility, fluid mixtures, conjugate heat transfer, and external body forces. GFSSP was developed at the Marshall Space Flight Center for flow analysis of rocket engine turbopumps and propulsion systems.
A brief overview of GFSSP’s capabilities will be given. Then a demonstration will show how to construct a simple GFSSP model from scratch. Finally, existing models will be presented to showcase applications of GFSSP, including tank pressurization, turbopump secondary flow analysis, waterhammer, priming, and propellant transfer line chilldown.

Harley Thermal LLC

Solaria and Solaria PCB
Presented By David Rosato
Solaria is a general-purpose thermal simulation tool. SolariaPCB is a front end to Solaria used to build accurate printed circuit board thermal models. SolariaPCB imports ECAD data through ODB++ files. Every trace, layer, plane, via and component is imported. SolariaPCB uses this data to generate a full 3D board Solaria thermal model that can typically be solved in minutes. Accurate conduction heat transfer in printed circuit boards is of importance to avionics, military and space applications. Multiple boards can then be merged into a chassis for a complete simulation calculating the junction temperature of every component on every board. Solaria/SolariaPCB includes all of these capabilities at an affordable purchase price.

Maya

Simcenter 3D – Leveraging ECAD Data for PCA Thermal Simulation
Presented By Carl J Poplawsky

Printed circuit board assembly (PCA) component reliability is heavily dependent on temperature, and so PCA thermal design and simulation is an important aspect of space craft development. With many traditional simulation tools, thermal representation of components and board copper content is tedious, time-consuming, and not conducive to simulation efforts early during PCA and space craft development. Simcenter 3D PCB Exchange enables a process that leverages the ECAD data for both mechanical and thermal design, reducing simulation model development to a fraction of its former effort. The process supports explicit representation of board layer copper content and via’s, and benefits from user-defined component catalogs. PCA thermal simulations can be conducted early and often, and also re-used for system-level simulation. This lecture will provide a full demonstration of the process.

User-Friendly Mappin of 3D Boundary Condition Data in Simcenter 3D Thermal/Flow and Space Systems Thermal
Presented By Carl J Poplawsky

It is very common to access data files (text or csv) of boundary conditions from 3rd party computer-based tools and map values on to a thermal simulation. Examples include high speed flow adiabatic wall temperatures, radiative heat fluxes from various sources, gas temperature and heat transfer coefficient distributions, and convective heat fluxes from exhaust plumes. Simcenter 3D offers 1D, 2D, 3D, and even 4D (time) fields, and also tables of fields, that read the data files directly and assign values to thermal elements. Equally important is the ability to verify the values assigned to the thermal simulation. Simcenter 3D offers bubble and contour plots of both the raw field data and the resulting field definition, contour plots of boundary condition values on the element faces, and brief or verbose displays of elemental values. This webinar will take the audience through the various field options and then demonstrate them on a relevant example using strictly out-of-the-box user-friendly functionality.

Siemens

Turbopump internal flow modeling using rotation capabilities of Simcenter Flomaster
Presented By Arie Nuetzel

In this lecture we show a method for considering rotation and fluid mixing effects in a one dimensional network analysis of internal flows in a typical rocket engine turbopump to asses leakage of oxidizer and propellant and the effectiveness of a helium purge system. We demonstrate using a combination of one-dimensional components for labyrinth seals, rotating passages and boundary conditions in combination with specialized two-dimensional cavity components to consider the unique geometry of the interior of a turbopump. We show how a graphical based system simulation tool can decrease both the time and effort required to develop an accurate network model of internal flows in rotating machinery.

TERMA B.V.

STAMP
Presented By Hans Guijt

We present thermal data handling software ‘STAMP’. It is a powerful and comprehensive software tool for conducting thermal tests (i.e. acquiring data from a multitude of instruments, controlling heaters, presenting data on screen, etc.).

Originally designed for the Large Space Simulator in ESTEC in the Netherlands with a goal of at least supporting 5000 sensors, and unlimited heaters and presentations, it is capable of supporting tests at any scale – from tiny chambers to huge facilities.

Veritrek

Veritrek Creation Tool
Presented By Derek Hengeveld

Veritrek enhances Thermal Desktop® analyses by enabling thousands of simulation results in seconds using Reduced-Order Models (ROMs). Leveraging this speed, Veritrek helps teams efficiently understand a thermal design space so they can focus on improved solutions. The Veritrek Creation Tool enables users to semi-automatically convert their Thermal Desktop models into a ROM. During this session, the Veritrek Creation Tool will be discussed and demonstrated using customer success stories and real-world applications. We will highlight several new and useful features including the ability to track registers, adding runs to an already-existing ROM to improve ROM accuracy, ROM creation parallelization, and ROM testing enhancements and methodology.

Veritrek Exploration Tool
Presented By Derek Hengeveld

Veritrek enhances Thermal Desktop® by enabling thousands of simulation results in seconds using Reduced-Order Models (ROMs). Leveraging this speed, Veritrek helps teams efficiently understand a thermal design space so they can focus on improved solutions. The Veritrek Exploration Tool gives users the ability to access the power of a ROM. During this session, the Veritrek Exploration Tool will be discussed and demonstrated using customer success stories and real-world applications. We will highlight the Exploration Tool’s analysis features and demonstrate how a ROM can be used throughout a thermal design’s cycle, from early design trade studies, to detailed design sensitivity studies, to thermal testing correlation efforts (a brand new capability), and finally to mission operations routines.

 

 

 

 

Vendor Virtual Product Demonstrations

For vendors seeking to provide a demonstrational overview of their products, TFAWS provides the option for a lecture-style session that grants a larger audience the opportunity to hear about their products directly from the vendor. Whether it be a spotlight on an innovative new technology, an educational overview on a product line, or a demonstration of a software tool’s features and updates, these sessions make it possible for the vendor to showcase their products while allowing attendees the opportunity to learn about the existing and new products that are helping to shape the thermal and fluids disciplines.

How to Register for a Vendor Session

Vendors interested in a product demonstration session or with questions should send an email to MSFC-TFAWS2020-VENDORS@mail.nasa.gov.